- Manufacturer:
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- CUI Devices (2)
- Material:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, EXTRUS... |
1 | 605 | Get Quote | ||
Wakefield Thermal | HEAT SINK PIN FIN... |
180 | 5,800 | Get Quote | ||
CUI Devices | HEAT SINK, EXTRUS... |
1,000 | 5,800 | Get Quote |