HSE-B20250-040H-01
- Mfr.Part #
- HSE-B20250-040H-01
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- Download
- Description
- HEAT SINK, EXTRUSION, TO-220, 25
- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- PC Pin
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-220
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 5.5W @ 75°C
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 4.44°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 13.64°C/W
- Type :
- Board Level
- Datasheets
- HSE-B20250-040H-01
Manufacturer related products
Catalog related products
related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| HSE-B1711-032 | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-220, 25 |
| HSE-B1711-057 | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-220, 25 |
| HSE-B18254-035H | CUI Devices | 624 | HEAT SINK, EXTRUSION, TO-218, 25 |
| HSE-B18254-035H-00 | WEC | 274 | HEAT SINK, EXTRUSION, TO-218, 25 |
| HSE-B18254-0396H | WEC | 222 | HEAT SINK, EXTRUSION,TO-218, 25. |
| HSE-B18254-060H-W | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 25 |
| HSE-B18317-035H | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 31 |
| HSE-B18317-035H-01 | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 31 |
| HSE-B18318-0396H | CUI Devices | 5,800 | HEAT SINK, EXTRUSION,TO-218, 31. |
| HSE-B18381-035H | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 38 |
| HSE-B18381-035H-02 | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 38 |
| HSE-B18381-0396H | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 38 |
| HSE-B18381-060H-W | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 38 |
| HSE-B18508-035H | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 50 |
| HSE-B18508-035H-03 | CUI Devices | 5,800 | HEAT SINK, EXTRUSION, TO-218, 50 |
