- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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30 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | 6.818WX11.81" EXTRUSI... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK SLIM VE... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK BXB50,75,1... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK DC/DC HA... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK CPU 21MM... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1 | 5,800 | Get Quote |
