- Manufacturer：
-
- Aavid (1)
- ABB Embedded Power (15)
- Comair Rotron (49)
- CTS Corporation (93)
- CUI Devices (2)
- Enclustra (1)
- Molex (2)
- Ohmite (15)
- Panasonic (2)
- Sanyo Denki (20)
- Seeed (3)
- Sunon (3)
- T-Global Technology (61)
- Wakefield Thermal (30)
- WEC (7)
- Material：
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- Type：
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- Shape：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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415 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK UNIVERS... |
1 | 43 | Get Quote | |
|
|
Ohmite | HEATSINK DUAL FO... |
1 | 58 | Get Quote | |
|
|
Aavid | HEATSINK TO-5 1W H... |
1 | 890 | Get Quote | |
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 | 92 | Get Quote | |
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 | 84 | Get Quote | |
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 | 75 | Get Quote | |
|
|
T-Global Technology | XL25 CERAMIC BOAR... |
1 | 127 | Get Quote | |
|
|
Ohmite | HEATSINK BLACK A... |
540 | 540 | Get Quote | |
|
|
T-Global Technology | PH3 76.2X19.1X0.21MM |
1 | 231 | Get Quote | |
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 | 61 | Get Quote | |
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 | 79 | Get Quote | |
|
|
TE Connectivity AMP Connectors | HEATSINK ASSEMBL... |
1 | 25 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 10... |
1 | 937 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 10... |
1 | 356 | Get Quote | |
|
|
TE Connectivity AMP Connectors | HTS665-2=HS PLTD |
1 | 28 | Get Quote | |
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 25MM... |
1 | 232 | Get Quote | |
|
|
TE Connectivity AMP Connectors | HTS389-P=HS ASSY PP... |
1 | 249 | Get Quote | |
|
|
Delta Electronics | FAN CPU COOLER 90X... |
1 | 289 | Get Quote | |
|
|
Ohmite | HEATSINK DUAL FO... |
1 | 203 | Get Quote | |
|
|
T-Global Technology | XL25 CERAMIC BOAR... |
1 | 1,855 | Get Quote |
