HSS02-B20-P318

Mfr.Part #
HSS02-B20-P318
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, STAMPING, TO-220, 23.
Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On and PC Pin
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-220
Part Status :
Active
Power Dissipation @ Temperature Rise :
6.9W @ 75°C
Shape :
Rectangular
Thermal Resistance @ Forced Air Flow :
4.80°C/W @ 200 LFM
Thermal Resistance @ Natural :
10.90°C/W
Type :
Board Level, Vertical
Datasheets
HSS02-B20-P318

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