678-39-C

Manufacturer :

Wakefield Thermal

Product Category :

Thermal - Heat Sinks

Attachment Method :

Clip, Solder Foot

Diameter :

-

Material :

Aluminum

Material Finish :

Black Anodized

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Part Status :

Active

Power Dissipation @ Temperature Rise :

-

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

0.60°C/W @ 600 LFM

Thermal Resistance @ Natural :

-

Type :

Board Level, Vertical