- Manufacturer :
- Ohmite
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA, CPU, GPU
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- -
- Shape :
- Square, Angled Fins
- Thermal Resistance @ Forced Air Flow :
- -
- Thermal Resistance @ Natural :
- 17.10°C/W
- Type :
- Top Mount
- Datasheets
- BGAH170-075E
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| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| BGAH150-075E | Ohmite | 96 | BGA HEATSINK W/TAPE |
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| BGAH190-090E | Ohmite | 406 | BGA HEATSINK W/TAPE |
| BGAH1A10E6327XTSA1 | Infineon Technologies | 5,800 | RF MMIC 3 TO 6 GHZ |
| BGAH270-175E | Ohmite | 67 | BGA HEATSINK W/TAPE |
| BGAH310-075E | Ohmite | 96 | BGA HEATSINK W/TAPE |
| BGAH325-075E | Ohmite | 90 | BGA HEATSINK W/TAPE |
| BGAH375-125E | Ohmite | 814 | BGA HEATSINK W/TAPE |
| BGAH425-125E | Ohmite | 72 | BGA HEATSINK W/TAPE |
| BGAH450-125E | Ohmite | 42 | BGA HEATSINK W/TAPE |
