TDA3MVRBFABFRQ1

Manufacturer :

Texas Instruments

Product Category :

Embedded - System On Chip (SoC)

Architecture :

DSP, MPU

Connectivity :

CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB

Core Processor :

ARM® Cortex®-M4, C66x

Flash Size :

-

Operating Temperature :

-40°C ~ 125°C (TJ)

Package / Case :

367-BFBGA, FCBGA

Part Status :

Active

Peripherals :

DMA, PWM, WDT

Primary Attributes :

-

RAM Size :

512KB

Speed :

212.8MHz, 745MHz

Supplier Device Package :

367-FCBGA (15x15)