IBR210 HEATSINK

Mfr.Part #
IBR210 HEATSINK
Manufacturer
iBASE Technology
Package/Case
-
Datasheet
Download
Description
HEATSINK;HSIBR210-B V-A
Manufacturer :
iBASE Technology
Product Category :
Thermal - Heat Sinks
Attachment Method :
Push Pin
Diameter :
-
Length :
-
Material :
-
Material Finish :
-
Package Cooled :
IBR210
Part Status :
Active
Power Dissipation @ Temperature Rise :
-
Shape :
-
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
-
Type :
Top Mount
Width :
-
Datasheets
IBR210 HEATSINK

Manufacturer related products

  • iBASE Technology
    AC, POWER SUPPLY 1+1 ;300W 100-
  • iBASE Technology
    100W 24V/12V DC-DC POWER SUPPLY
  • iBASE Technology
    100W 72~110V/12V DC-DC POWER SUP
  • iBASE Technology
    FC, DP TO 2ND LVDS CARD , WITH D
  • iBASE Technology
    FC, 40-PIN IDE TO COMPACT FLASH

Catalog related products

related products

Part Manufacturer Stock Description
IBR210-D308 iBASE Technology 5,800 NXP CORTEX-A53 I.MX 8M DUAL 1.5G
IBR210-D308I iBASE Technology 5,800 NXP CORTEX-A53 I.MX 8M DUAL-I 1.
IBR210-Q316 iBASE Technology 5,800 NXP CORTEX-A53 I.MX 8M QUAD 1.5G
IBR210-Q316I iBASE Technology 5,800 NXP CORTEX-A53 I.MX 8M QUAD-I 1.