655-26AB

Mfr.Part #
655-26AB
Manufacturer
Wakefield Thermal
Package/Case
-
Datasheet
Download
Description
HEATSINK FOR 40MM BGA
Manufacturer :
Wakefield Thermal
Product Category :
Thermal - Heat Sinks
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Part Status :
Active
Power Dissipation @ Temperature Rise :
5.0W @ 60°C
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
3.00°C/W @ 500 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount
Datasheets
655-26AB

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