SIP1X09-001BLF

Mfr.Part #
SIP1X09-001BLF
Manufacturer
Amphenol Communication Solutions
Package/Case
-
Datasheet
Download
Description
CONN SOCKET SIP 9POS GOLD
Manufacturer :
Amphenol Communication Solutions
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Closed Frame
Housing Material :
Polyphenylene Sulfide (PPS), Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
9 (1 x 9)
Operating Temperature :
-
Part Status :
Obsolete
Termination :
Solder
Type :
SIP
Datasheets
SIP1X09-001BLF

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