SMDSW.020 8OZ
- Mfr.Part #
- SMDSW.020 8OZ
- Manufacturer
- Chip Quik, Inc.
- Package/Case
- -
- Datasheet
- Download
- Description
- SOLDER WIRE 63/37 TIN/LEAD NO-CL
- Manufacturer :
- Chip Quik, Inc.
- Product Category :
- Solder
- Composition :
- Sn63Pb37 (63/37)
- Flux Type :
- No-Clean, Water Soluble
- Form :
- Spool, 8 oz (227g), 1/2 lb
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Leaded
- Shelf Life :
- -
- Shelf Life Start :
- -
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- 24 AWG, 25 SWG
- Datasheets
- SMDSW.020 8OZ
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| SMDSW.015 100G | Chip Quik, Inc. | 5,800 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.020 .4OZ | Chip Quik, Inc. | 41 | SOLDER WIRE POCKET PACK 63/37 TI |
| SMDSW.020 1LB | Chip Quik, Inc. | 9 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.020 1OZ | Chip Quik, Inc. | 21 | SOLDER WIRE NO-CLEAN 63/37 1OZ. |
| SMDSW.020 2OZ | Chip Quik, Inc. | 9 | SOLDER WIRE NO-CLEAN 63/37 2OZ. |
| SMDSW.020 4OZ | Chip Quik, Inc. | 25 | SOLDER WIRE NO-CLEAN 63/37 4OZ. |
| SMDSW.031 .7OZ | Chip Quik, Inc. | 33 | SOLDER WIRE POCKET PACK 63/37 TI |
| SMDSW.031 1LB | Chip Quik, Inc. | 17 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.031 1OZ | Chip Quik, Inc. | 23 | SOLDER WIRE NO-CLEAN 63/37 1OZ. |
