- Manufacturer：
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- Ohmite (1)
- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK W/CLIP -... |
1 | 46 | Get Quote | |
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 | 12 | Get Quote | |
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 | 9 | Get Quote | |
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 | 81 | Get Quote |
