- Manufacturer：
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- CTS Corporation (2)
- CUI Devices (1)
- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
300 | 5,800 | Get Quote | |
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,200 | 5,800 | Get Quote | |
|
|
CTS Corporation | HEATSINK FORGED ... |
300 | 5,800 | Get Quote |
