- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
9,000 | 5,800 | Get Quote | |
|
|
CUI Devices | HEAT SINK TO-252 CO... |
10,500 | 5,800 | Get Quote |
