- Manufacturer:
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- CTS Corporation (1)
- CUI Devices (1)
- Material:
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- Type:
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- Package Cooled:
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- Thermal Resistance @ Forced Air Flow:
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5 Records
Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
---|---|---|---|---|---|---|
Wakefield Thermal | HEAT SINK ELLIP F... |
180 | 5,800 | Get Quote | ||
CTS Corporation | HEATSINK FORGED ... |
100 | 5,800 | Get Quote | ||
Wakefield Thermal | HEAT SINK ELLIP F... |
128 | 5,800 | Get Quote | ||
Wakefield Thermal | HEAT SINK PIN FIN... |
128 | 5,800 | Get Quote | ||
CUI Devices | HEAT SINK, EXTRUS... |
1,200 | 5,800 | Get Quote |