- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (1)
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 | 687 | Get Quote | |
|
|
CTS Corporation | HEATSINK FORGED ... |
300 | 5,800 | Get Quote |
