- Manufacturer：
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- CUI Devices (2)
- Material：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
180 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
180 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
128 | 5,800 | Get Quote | |
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 | 5,800 | Get Quote | |
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,350 | 5,800 | Get Quote |
