Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
Image Part Manufacturer Description MOQ Stock
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127755 Wakefield Thermal
4.00" WIDE X 36" FLAT...
1 29 Get Quote
127709 Wakefield Thermal
4.00" WIDE X 12" FLAT...
1 21 Get Quote
127699 Wakefield Thermal
1.845" WIDE X 12" FLAT...
1 46 Get Quote
HS05 Apex Microtechnology
HEATSINK 8P TO-3 15...
1 5,800 Get Quote
127749 Wakefield Thermal
1.845" WIDE X 36" FLAT...
1 5,800 Get Quote
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