- Manufacturer:
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- Aavid (1)
- CUI Devices (1)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 | 1,798 | Get Quote | ||
Aavid | HEATSINK BGA W/AD... |
1 | 784 | Get Quote |