- Manufacturer:
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- CTS Corporation (1)
- CUI Devices (1)
- Material:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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11 Records
Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
10 | 5,800 | Get Quote | ||
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X7.5M... |
10 | 5,800 | Get Quote | ||
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X14.5M... |
10 | 5,800 | Get Quote | ||
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 | 95 | Get Quote | ||
CUI Devices | HEAT SINK, STAMPI... |
1 | 2,336 | Get Quote | ||
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 | 98 | Get Quote | ||
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 | 498 | Get Quote | ||
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 | 758 | Get Quote | ||
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
1 | 463 | Get Quote | ||
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
1 | 664 | Get Quote | ||
CTS Corporation | HEAT SINK FORGED... |
300 | 5,800 | Get Quote |