- Manufacturer：
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- Aavid (6)
- Comair Rotron (2)
- CUI Devices (1)
- Part Status：
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- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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12 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
Aavid | HEATSINK TO-220 CL... |
1 | 3,335 | Get Quote | |
|
|
Aavid | HEATSINK TO-220 W/T... |
1 | 3,573 | Get Quote | |
|
|
Aavid | HEATSINK TO-220 VE... |
1 | 2,035 | Get Quote | |
|
|
Aavid | HEATSINK TO-220 CL... |
1 | 8,196 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
1 | 18,763 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 6.... |
1 | 5,800 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 19... |
1 | 5,800 | Get Quote | |
|
|
Aavid | BOARD LEVEL HEAT... |
10,000 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
1 | 5,800 | Get Quote | |
|
|
Aavid | BOARD LEVEL HEAT... |
2,000 | 5,800 | Get Quote | |
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
3,672 | 5,800 | Get Quote | |
|
|
Wakefield Thermal | BOARD LEVEL HEAT... |
3,000 | 5,800 | Get Quote |
