- Part Status:
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- Material:
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- Type:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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10 Records
Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK FOR 35MM... |
1,800 | 5,800 | Get Quote | ||
Ohmite | HEATSINK D2PAK TO... |
1 | 5,800 | Get Quote | ||
Ohmite | HEATSINK D2PAK TO... |
1 | 5,800 | Get Quote | ||
Wakefield Thermal | HEATSINK FOR 35MM... |
1,800 | 5,800 | Get Quote | ||
Wakefield Thermal | HEATSINK FOR 35MM... |
1,800 | 5,800 | Get Quote | ||
Wakefield Thermal | HEATSINK FOR 35MM... |
1,800 | 5,800 | Get Quote | ||
Wakefield Thermal | HEATSINK FOR 35MM... |
1,800 | 5,800 | Get Quote | ||
Ohmite | HEATSINK D2PAK TO... |
200 | 5,800 | Get Quote | ||
Aavid | BOARD LEVEL HEAT... |
2,000 | 5,800 | Get Quote | ||
Ohmite | HEATSINK D2PAK TO... |
200 | 5,800 | Get Quote |