- Manufacturer:
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- CUI Devices (1)
- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X14.5M... |
10 | 5,800 | Get Quote | ||
Wakefield Thermal | HEATSINK 21X15MM D... |
1 | 81 | Get Quote | ||
Wakefield Thermal | HEATSINK 21X15MM S... |
1 | 99 | Get Quote | ||
Wakefield Thermal | HEATSINK 21X15MM F... |
1 | 99 | Get Quote | ||
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
1 | 36 | Get Quote | ||
Wakefield Thermal | HEATSINK EXTRUSI... |
1,000 | 5,800 | Get Quote | ||
CUI Devices | HEATSINK TO-220 3.2W... |
10,000 | 5,800 | Get Quote |