- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
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CUI Devices | HEATSINK TO-220 2.6W... |
1 | 635 | Get Quote | |
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 | 162 | Get Quote | |
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 | 951 | Get Quote |
