- Type:
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- Attachment Method:
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- Thermal Resistance @ Forced Air Flow:
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2 Records
Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
---|---|---|---|---|---|---|
CUI Devices | HEATSINK TO-220 4.4W... |
3,000 | 5,800 | Get Quote | ||
CUI Devices | HEATSINK TO-220 4.4W... |
4,000 | 5,800 | Get Quote |