- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 | 5,800 | Get Quote | |
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,350 | 5,800 | Get Quote |
