- Manufacturer：
-
- CUI Devices (2)
- Type：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock |
Online Service
|
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 | 600 | Get Quote | |
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 | 5,492 | Get Quote | |
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 | 12,616 | Get Quote | |
|
|
CUI Devices | HEAT SINK TO-263 CO... |
9,000 | 5,800 | Get Quote |
