- Manufacturer :
- 3M
- Product Category :
- Панели для микросхем, транзисторов
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 30.0µin (0.76µm)
- Contact Finish Thickness - Post :
- 30.0µin (0.76µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyethersulfone (PES)
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 72 (25 x 25)
- Operating Temperature :
- -55°C ~ 150°C
- Part Status :
- Active
- Termination :
- Solder
- Type :
- PGA, ZIF (ZIP)
- Спецификации
- 272-6325-9UA-1902
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