BU200Z-178-HT

Mfr.Part #
BU200Z-178-HT
Manufacturer
On-Shore Technology, Inc.
Package/Case
-
Datasheet
Download
Description
CONN IC DIP SOCKET 20POS GOLD
Manufacturer :
On-Shore Technology, Inc.
Product Category :
Панели для микросхем, транзисторов
Contact Finish - Mating :
Gold
Contact Finish - Post :
Copper
Contact Finish Thickness - Mating :
78.7µin (2.00µm)
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
20 (2 x 10)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Active
Termination :
Solder
Спецификации
BU200Z-178-HT

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