TS391LT250
- Mfr.Part #
- TS391LT250
- Manufacturer
- Chip Quik, Inc.
- Package/Case
- -
- Datasheet
- Download
- Description
- THERMALLY STABLE SOLDER PASTE NO
- Manufacturer :
- Chip Quik, Inc.
- Product Category :
- припой
- Composition :
- Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 8.8 oz (250g)
- Melting Point :
- 281°F (138°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 68°F ~ 77°F (20°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Спецификации
- TS391LT250
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| TS391AX | Chip Quik, Inc. | 5,800 | THERMALLY STABLE SOLDER PASTE NO |
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| TS391AX500C | Chip Quik, Inc. | 6 | THERMALLY STABLE SOLDER PASTE NO |
| TS391ILT | STMicroelectronics | 55,007 | IC COMP LO PWR SGL V SOT 23-5L |
| TS391IQ2T | STMicroelectronics | 1,680 | IC VOLT COMPARATOR SGL 8DFN |
| TS391IYLT | STMicroelectronics | 17,501 | IC VOLT COMPARATOR SGL SOT-23-5 |
| TS391LT | Chip Quik, Inc. | 34 | THERMALLY STABLE SOLDER PASTE NO |
| TS391LT10 | Chip Quik, Inc. | 5,800 | THERMALLY STABLE SOLDER PASTE NO |
| TS391LT50 | Chip Quik, Inc. | 5,800 | THERMALLY STABLE SOLDER PASTE NO |
| TS391LT500C | Chip Quik, Inc. | 3 | THERMALLY STABLE SOLDER PASTE NO |
| TS391RILT | STMicroelectronics | 5,800 | IC COMPARATOR SGL LP SOT-23-5 |
