A14162-06
- Mfr.Part #
- A14162-06
- Manufacturer
- Laird - Performance Materials
- Package/Case
- -
- Datasheet
- Download
- Description
- THERM PAD 228.6MMX228.6MM GRAY
- Manufacturer :
- Laird - Performance Materials
- Product Category :
- 散热 - 垫、板
- Adhesive :
- Tacky - Both Sides
- Backing, Carrier :
- -
- Color :
- Gray
- Material :
- Silicone Elastomer
- Outline :
- 228.60mm x 228.60mm
- Part Status :
- Obsolete
- Shape :
- Square
- Thermal Conductivity :
- 1.1W/m-K
- Thermal Resistivity :
- 2.51°C/W
- Type :
- Gap Filler Pad, Sheet
- Usage :
- -
- 数据列表
- A14162-06
Manufacturer related products
Catalog related products
related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| A14100A-1BG313C | Microchip Technology | 5,800 | IC FPGA 228 I/O 313BGA |
| A14100A-1CQ256B | Microchip Technology | 5,800 | IC FPGA 228 I/O 256CQFP |
| A14100A-1CQ256C | Microchip Technology | 5,800 | IC FPGA 228 I/O 256CQFP |
| A14100A-1CQ256M | Microchip Technology | 5,800 | IC FPGA 228 I/O 256CQFP |
| A14100A-1PG257B | Microchip Technology | 5,800 | IC FPGA 228 I/O 257CPGA |
| A14100A-1PG257C | Microchip Technology | 5,800 | IC FPGA 228 I/O 257CPGA |
| A14100A-1PG257M | Microchip Technology | 5,800 | IC FPGA 228 I/O 257CPGA |
| A14100A-1RQ208C | Microchip Technology | 5,800 | IC FPGA 175 I/O 208RQFP |
| A14100A-1RQ208I | Microchip Technology | 5,800 | IC FPGA 175 I/O 208RQFP |
| A14100A-BG313C | Microchip Technology | 5,800 | IC FPGA 228 I/O 313BGA |
| A14100A-CQ256B | Microchip Technology | 5,800 | IC FPGA 228 I/O 256CQFP |
| A14100A-CQ256C | Microchip Technology | 5,800 | IC FPGA 228 I/O 256CQFP |
| A14100A-CQ256M | Microchip Technology | 5,800 | IC FPGA 228 I/O 256CQFP |
| A14100A-PG257B | Microchip Technology | 5,800 | IC FPGA 228 I/O 257CPGA |
| A14100A-PG257C | Microchip Technology | 5,800 | IC FPGA 228 I/O 257CPGA |
